Scriber – Dynatex GST-150

Dynatex
Operative
Claudio Somaschini
Authorized user
Metrology

Description:

Dynatex GST-150 allows dicing of semiconductor wafers with a dry process. In order to break the wafer, a scribe line is created in the wafer surface with an electronically controlled diamond tip. The scribe line creates a stress concentration so that the force applied by a breaking impulse causes the wafer to separate exactly along the desired lines.

Specifications

  • Less than 5 µm wide scribe line
  • Auto aligning vision system
  • Adjustable scribe and impulse force
  • Adjustable scribe angle (Normally 32°-37°)
  • Scribe speed up to 10 inches per second