Wafer Cleaning Station – Disco DCS141
Details
Manufacturer
Disco
Website
Contact person
Stefano Bigoni, Gianluca Cannetti
Location
Description:
The Disco DSC141 spinning unit cleans semiconductor wafers, glass, ceramics, and a wide variety of other workpieces. Appropriate for use with the automatic dicing saw (Disco DAD341) and other machines that lack a cleaning function, the unit allows cleaning with water and drying.
Specifications:
- Maximum workpiece size: 8″
- Rotating speed range: 0-3000 rpm
- Spinning discharge pressure: 2-12 MPa
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