Wafer Cleaning Station – Disco DCS141
Disco
Operative
Stefano Bigoni, Stefano Fasoli
Authorized user
Back-end
Description:
The Disco DSC141 spinning unit cleans semiconductor wafers, glass, ceramics, and a wide variety of other workpieces. Appropriate for use with the automatic dicing saw (Disco DAD341) and other machines that lack a cleaning function, the unit allows cleaning with water and drying.Specifications:
- Maximum workpiece size: 8″
- Rotating speed range: 0-3000 rpm
- Spinning discharge pressure: 2-12 MPa