Wafer Cleaning Station – Disco DCS141

Disco
Operative
Claudio Somaschini, Lorenzo Livietti
Authorized user
Back-end

Description:

The Disco DSC141 spinning unit cleans semiconductor wafers, glass, ceramics, and a wide variety of other workpieces. Appropriate for use with the automatic dicing saw (Disco DAD341) and other machines that lack a cleaning function, the unit allows cleaning with water and drying.

Specifications

  • Maximum workpiece size: 8″
  • Rotating speed range: 0-3000 rpm
  • Spinning discharge pressure: 2-12 MPa