Dicing Saw – Disco DAD341

Disco
Operative
Claudio Somaschini, Lorenzo Livietti
Authorized user
Back-End

Description:

The Disco DAD341 dicing saw allows to cut silicon, glass, and ceramic workpieces with a high degree of accuracy. The system can accomodate substrates up to 4 mm thick and supports sizes up to 8″ (203 mm). Dicing of the full wafer can be accomplished automatically while custom cuts can be performed in semi-automatic mode.

Specifications

  • Maximum workpiece size: 8″
  • Maximum substrate thickness: 4 mm
  • Measurement resolution: 0.1 µm
  • Positioning accuracy: 0.5 µm