Claudio Somaschini, Lorenzo Livietti
Description:The Disco DAD341 dicing saw allows to cut silicon, glass, and ceramic workpieces with a high degree of accuracy. The system can accomodate substrates up to 4 mm thick and supports sizes up to 8″ (203 mm). Dicing of the full wafer can be accomplished automatically while custom cuts can be performed in semi-automatic mode.
- Maximum workpiece size: 8″
- Maximum substrate thickness: 4 mm
- Measurement resolution: 0.1 µm
- Positioning accuracy: 0.5 µm