ALD – Beneq TFS 200
Details
Manufacturer
Beneq
Website
Contact person
Matteo Villa, Andrea Scaccabarozzi
Location
Description
The Beneq TFS 200 is an Atomic Layer Deposition platform.
It supports deposition on diverse substrates including wafers, planar objects, porous materials, and complex 3D structures with high aspect ratio (HAR) features, enabling precise coating in even the most demanding applications.
It also offers direct and remote plasma-enhanced ALD (PEALD) on substrates up to 200 mm, and it is equipped with a load lock chamber.
Specifications
- Temperature range: 25-500 °C
- Substrate size: up to 200 mm x 200 mm
- Materials: Al2O3, TiO2
Do you have any question on this equipment?
