Wet Bench Multi Wafers Etching – SPM

Andrea Scaccabarozzi, Stefano Fasoli
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Wet Process


The bench is equipped with 2 heated-closed loop drain chemical tanks for Solvents and KOH, 1 Teflon tank for HF etching, 2 heated acid etch tanks and 2 dump rinse tanks.

Working principle

The solvents side of the bench has manually operated drain, the acid part (HF and the other 2 heated tanks) has the automatic controlled drain setup.


Supplied with DI Water at 18 MOhm.